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Semiconduct Trim & Form Singulation Tool

HOME > 제품소개 > 자동화(Tool) > Semiconduct Trim & Form Singulation Tool
WEMC De_Junk & De_Gate Tools (update 4/4)

• Performance

- Modula Type
- High Speed Tool Design
- Frame width : 40 ~ 80mm

• Station Process

1. 1st TOOL
  - DE-GATE
  - SLITTING(LEAD TRIM)
2. 2nd TOOL
  - 1ST Module - FORMING
  - 2nd Module - SINGULATION

• Applicable PKG

TTSOP, TSOP, TO, SOD, SOIC, SOJ, SOT, SC, etc…

• Tool size

  - 1ST Master Die : W180 x D192.5 x H197mm
  - 2ND Master Die : W220 x D192.5 x H197mm